PCB and box-build end-of-line inspection.
Solder joint quality, component presence and orientation, conformal coating coverage, and connector insertion verification at the final assembly stage. Designed to support IPC-A-610 acceptability criteria.
End-of-line is different from in-process AOI
Automated optical inspection (AOI) systems at SMT and through-hole stages catch placement errors before reflow. End-of-line inspection catches a different class of defects: post-test connector damage, conformal coating holidays over through-hole areas, box-build assembly errors, and final label verification. These defects aren't visible at SMT stage — they occur after wave soldering, cleaning, and manual assembly steps.
Eolvision is designed for PCB contract manufacturers running IPC-A-610 Class 2 or Class 3 production. Inspection thresholds are configurable per class level per production run.
Electronics end-of-line inspection coverage
Solder joint quality
- Cold solder joint detection
- Bridging between pads
- Insufficient solder volume
- Excessive solder fillet
- Tombstoning (component tilt)
- Lifted lead detection
Component presence & orientation
- Missing component detection
- Wrong orientation (polarity)
- Wrong component value marker
- Damaged component body
- Missing hardware (standoff, screw)
- Box-build component completeness
Coating & connector
- Conformal coating holiday
- Coating thickness uniformity
- Connector not fully inserted
- Connector damage (pin bent)
- Board-level label presence
- Barcode / serial number legibility
IPC-A-610 quality standard context
Eolvision is designed to support IPC-A-610 Class 2 (industrial electronics) and Class 3 (high-reliability electronics) acceptability criteria. Specific provisions supported:
- — Section 7: Solder connections — Class 2 and Class 3 accept/reject thresholds
- — Section 10: Terminal connections — component presence verification
- — Section 14: Conformal coating — holiday and coverage verification
Designed with these controls in mind. Not a compliance certification. Verify with your quality manager.
Coaxial lighting for solder inspection
Solder joint inspection requires coaxial illumination to capture specular reflection from the solder fillet. This lighting configuration shows solder joint geometry clearly by revealing the transition zone between a correctly formed fillet and a cold or insufficient joint. Eolvision recommends coaxial lighting paired with a 2D area scan camera at 5–12 megapixel resolution for through-hole and SMD solder inspection.
See lighting configurationsTalk to us about your PCB line
We'll assess your assembly stages, defect catalogue, and IPC class requirements before specifying a camera and lighting configuration.